We have been tasked with designing a high-performance compute platform (HPC) for Panasonic to be inserted into vehicles of various makes and models. The assembly must: house four PCB assemblies (cards) and dissipate 1000W of heat total from the system (225W Per Card for 900W total and 100W for back plate), allow for easy end-user removal and replacement of cards for maintenance and updates, survive automotive environment test conditions (survive “shake and bake”), and be designed to IP6K8 (dust-tight and continuous submersion against water).
Department Mechanical Engineering
Sponsor Panasonic Automotive Systems Company of America
Advisor Dr. Jiao
Primary Email Contact
Table # 4


Name Major Hometown
Addison Reynolds ME Glasgow, Kentucky
Alexander Mintchev ME Portland, ME
Brett Roth ME Boca Raton, FL
Erin Mcginley ME Tewksbury, MA
Justin Cobb ME Atlanta
Vishnu Achar ME Suwanee