Description
We have been tasked with designing a high-performance compute platform (HPC) for Panasonic to be inserted into vehicles of various makes and models. The assembly must: house four PCB assemblies (cards) and dissipate 1000W of heat total from the system (225W Per Card for 900W total and 100W for back plate), allow for easy end-user removal and replacement of cards for maintenance and updates, survive automotive environment test conditions (survive “shake and bake”), and be designed to IP6K8 (dust-tight and continuous submersion against water).